Bambu Lab PC (Polycarbonate) 3D Printing Filament
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Product Features
- Exceptional Thermal Resistance
- Excellent Mechanical Properties
- High Impact Strength and Durability
- Suitable for Engineering Purpose
- Comes with High Temperature Reusable Spool
- Diameter: 1.75mm +/- 0.03mm
Cautions for Use
- Dry out before use
- AMS Compatible
- AMS lite NOT Compatible
- Enclosure Printers Required
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Estimate delivery times: 1-2 days
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Bambu Lab PC (Polycarbonate) 3D Printing Filament

Exceptional Thermal Resistance: Defying High Temperatures

Excellent Mechanical Properties: Precision in Every Layer

RFID for Intelligent Printing
Technical Specifications
Drying Settings (Blast Drying Oven) | 80 °C,8h |
Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) |
Nozzle Temperature | 250 - 270 °C |
Bed Temperature (with Glue) | 90 - 110 °C |
Printing Speed | < 300 mm/s |
Density | 1.20 g/cm³ |
Vicat Softening Temperature | 119 °C |
Heat Deflection Temperature | 117 °C |
Melting Temperature | 228 °C |
Melt Index | 32.2 ± 2.9 g/10 min |
Tensile Strength | 55 ± 4 MPa |
Breaking Elongation Rate | 3.8 ± 0.3 % |
Bending Modulus | 2310 ± 70 MPa |
Bending Strength | 108 ± 4 MPa |
Impact Strength | 34.8 ± 2.1 kJ/m² |